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Monthly Archives: August 2024
[News] Kioxia Filed for Listing, Reportedly Marking Japan’s Largest IPO of the Year
According to a report by the Nikkei, Japanese chip manufacturer Kioxia has submitted its initial public offering (IPO) application to the Tokyo Stock Exchange, triggering a long-awaited move as the development of artificial intelligence (AI) drives a surge in semiconductor …
[News] China’s Import of Chip Making Equipment Hit New High This Year, with Mature Nodes Driving the Demand
China has turned itself into “the world’s market” for semiconductor, while it eyes to play a crucial role in chip manufacturing by procuring more equipment. The latest reports by Bloomberg and Technews, citing data from China’s General Administration of Customs, indicates …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged ASML, China, chip war, EUV, SMIC
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[News] Rebellions Accelerates Next-Gen AI Chip Production, Featuring Four Samsung HBM3e
According to a report from Korean media outlet BusinessKorea, Rebellions’ CTO Oh Jin-wook announced that the company will adjust its production plans, bypassing the initially planned Rebel ‘Single’ product to focus on the mass production of the Rebel Quad AI …
[News] SK Hynix President to Join Semicon Taiwan, Bolstering HBM Partnership with TSMC and NVIDIA
According to a report from the Commercial Times, SK hynix is expected to announce a plan of closer collaboration with TSMC and NVIDIA during the Semicon Taiwan exhibition in September, which is likely to focusing on the development of next-generation HBM. This …
[News] Samsung’s Backside Power Delivery Network Reportedly to Reduce 2nm Chip Size by 17%
Earlier in June, Samsung updated its roadmap in the Angstrom era, stating that its 2nm node optimized with backside power delivery network (BSPDN), referred to as SF2Z, will enter mass production in 2027. Now, according to the latest report by …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged BSPDN, Intel, Samsung, TSMC
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