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Monthly Archives: September 2024
[News] Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development
No eternal allies. No perpetual enemies. The old proverb seems so true when it comes to the semiconductor industry, when the world’s top foundry, TSMC, announced the collaboration with its rival Samsung, the second largest foundry globally, on the development …
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors
Tagged HBM4, Samsung, SK Hynix, TSMC
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[News] Amidst Rumors of Germany Plant Delay, Intel’s Penang Project Also Reportedly on Hold
According to Reuters citing sources, Intel, facing a critical survival crisis, has temporarily halted its new chip packaging and testing project in Penang. Malaysian media outlet The Star, citing informed sources, reported that Intel will temporarily halt its new chip …
Posted in Semiconductors, Wafer Foundries
Tagged 18A, 20A, Broadcom, Intel, Malaysia
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[News] ADP Report Shows Slowdown of Labor Market, while ISM Services PMI Remains in Expansion
The U.S. non-farm payroll data for August is set to be released on September 6. Ahead of that, the ADP employment report, often referred to as the “mini-NFP,” was published on September 5. The report revealed that private-sector employment in the US …
[News] 300mm Wafer Fab Construction Picks up Steam Worldwide
Amid the rising of emerging applications in the AI market, the booming demands for high-performance computing (HPC), high-bandwidth memory (HBM), CoWoS advanced packaging, and high-performance storage, have energized the wafer foundry industry. Given the broader applicability of 12-inch wafer in …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged CoWoS, HBM, HPC, HuaHong, Intel, NXP, SMIC, Texas Instruments, TSMC, UMC, VIS
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[News] Samsung Signals Will to Collaborate with Other Foundries on Basedie
At the SEMICON Taiwan 2024, Samsung’s Head of Memory Business, Jung Bae Lee, stated that as the industry enters the HBM4 era, collaboration between memory makers, foundries, and customers is becoming increasingly crucial. Reportedly, Samsung is prepared with turnkey solutions …
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors
Tagged 12nm, DDR5, HBM4, memory, Samsung, SEMICON, SK Hynix, Taiwan, TSMC
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