-
Recent Posts
- [News] iPhone 16 Assembly Expands to Brazil, Joining China and India
- [News] Intel’s Plant Delay Casts Doubt on German Economy, with Chances of Proceeding Estimated at No More than 50%
- [News] NAND Flash: Embracing a New Development Phase
- [News] Morgan Stanley Predicts ‘DRAM Winter,’ But TrendForce Remains Less Pessimistic
- [New] Seven Chinese Chip Design Companies You Need to Know—All Aiming to Replace Nvidia
Recent Comments
Archives
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Monthly Archives: September 2024
[News] Loongson Zhongke Technology Claims Next-Generation Processor Performance “World Leading,” Set to Debut in 2H25
At its 2024 semi-annual results briefing, Loongson Zhongke Technology announced that the 3B6600 processor is expected to begin sampling in the first half of next year and be officially released in the second half. Per a report from IThome, Chairman …
[News] ACM Research Launches Panel-Level Etching Tool, Expanding Its FOPLP Porfolio
ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This …
Posted in Semiconductors
Tagged ACM Research, ASE Group, FOPLP, Innolux, JSnepes, Powertech Technology, Samsung, semiconductor, SPIL, TSMC
Leave a comment
[News] Samsung’s 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant
While Samsung Electronics is said to be delivering an oversea workforce cut up to 30%, a report from Korean media outlet Business Korea on September 11th has added that persistent issues with its 2nm yield rate have led Samsung to …
Posted in Semiconductors, Wafer Foundries
Tagged 2nm, Samsung, TSMC, US, wafer foundry
Leave a comment
[News] Samsung Reportedly Buckling Under Pressure, with Plans to Cut Overseas Workforce by Up to 30%
According to a report from Reuters citing sources, Samsung Electronics, the global leading manufacturer of smartphones, TVs, and memory, is said to be cutting up to 30% of its overseas workforce in certain departments. Per the same report, sources revealed that Samsung …
Posted in Semiconductors, Wafer Foundries
Tagged memory, Samsung, Samsung Electronics, SK Hynix, smartphone
Leave a comment
[News] CEO Jensen Huang Highlights Strong Demand, Stating that Everyone is Counting on NVIDIA
Amid concerns on the delay of NVIDIA’s Blackwell, CEO Jensen Huang spoke at the Goldman Sachs Communacopia and Technology Conference a few hours ago, trying to ease the doubts of the market by expressing his optimism on the demand of …
Posted in Artificial Intelligence, Emerging Technologies, IC Design, Semiconductors
Tagged Blackwell, H200, Nvidia
Leave a comment