Monthly Archives: October 2024

[News] Intel’s Unfulfilled USD 20 Billion Proposal to NVIDIA Reportedly Keeps It out of the AI Boom

Posted on 2024-10-25 by TrendForce

What if the struggling giant, Intel, has not be left out of the AI wave? What if it is able to team up with NVIDIA, the world’s second-largest company by market capital currently? Surprisingly, it used to have the chance. According …

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Posted in Artificial Intelligence, Emerging Technologies | Tagged , | Leave a comment

[News] Fed Beige Book Lowers Market Expectations for Further Rate Cuts

Posted on 2024-10-25 by TrendForce

U.S. economic activity remained stable across most regions, according to the Beige Book released by the Federal Reserve on October 23, and it lowered market expectations for further rate cuts. A survey conducted by the 12 Federal Reserve Banks showed …

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[News] TSMC’s First Plant in Arizona Achieves Early Chip Production Yields Higher than Taiwan’s

Posted on 2024-10-25 by TrendForce

According to a report from Bloomberg, TSMC’s first wafer fab built in Arizona, USA, has achieved a major breakthrough in early production yield, surpassing that of similar factories in Taiwan. The report in Bloomberg indicates that, citing the words from …

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[News] U.S. Jobless Claims Drop, but Continuing Claims Hit 3-Year High

Posted on 2024-10-25 by TrendForce

The U.S. initial jobless claims have decreased last week, while continuing claims have reached their highest level in nearly three years, potentially reflecting increased difficulty for workers in finding new employment. The U.S. initial jobless claims for the previous week …

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[News] TSMC-Made Huawei Chips Raise U.S. Concerns; Reports Suggest Huawei Used Proxy to Place Orders

Posted on 2024-10-25 by TrendForce

The discovery of TSMC-manufactured chips in Huawei devices has sparked significant concern among U.S. lawmakers. John Moolenaar, Chairman of the U.S. Congressional Committee on the Chinese Communist Party (CCP) and a Republican Congressman, criticized the reports, calling it a “catastrophic …

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Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , | Leave a comment