Monthly Archives: November 2024

[News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 …

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[News] Russia Reportedly Resumes Baikal-S Processor Production Despite Sanctions

According to a report by CNews, a prominent Russian high-tech industry news outlet, Vasily Shpak, Russia’s Deputy Minister of Industry and Trade, announced at the Electronica Russia trade show in Moscow on October 26 that the Baikal series microprocessors, developed …

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[News] Cisco Reportedly Bans Chinese-Origin Products as U.S. Tightens Chip Rules, Micron Poised to Benefit

Following the footsteps of PC makers such as Dell and HP, which reportedly aim to reduce the number of components made in China as quickly as possible, a report by technowvoice suggests that American networking giant Cisco is also joining …

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[News] Chinese EV Leader BYD Pressures Suppliers for 10% Price Cuts, Sparking Fears of an EV Price War

Due to the fierce price competition in China’s automobile market, according to a report from Commercial Times, on the 27th, leading new energy vehicle (NEV) manufacturers BYD and SAIC Maxus have reportedly requested their suppliers to reduce prices by 10%. …

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[News] Intel’s USD 7.86 Billion Subsidy Deal under CHIPS Act Reportedly Limits Foundry Stake Sale

Intel has finally secured the USD 7.86 billion in direct funding under the U.S. CHIPS Act a couple of days ago. However, there is a premise: the company would not be allowed to sell its stake in the chipmaking unit …

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