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Monthly Archives: November 2024
[News] Samsung and SK hynix Face Uncertainties amid Trump’s Potential CHIPS Act Subsidy Review
According to a report from UDN News, citing Politico, Vivek Ramaswamy, co-leader of the Department of Government Efficiency (DOGE) designated by Trump, has called the subsidies under the U.S. CHIPS Act “wasteful.” While companies like TSMC, GlobalFoundries, and Intel have …
[News] Samsung Cuts Photoresist Usage in 3D NAND Production, Boosting Cost Efficiency
Samsung has significantly reduced the amount of photoresist (PR) used during the photolithography process in its 3D NAND flash production, according to a report by The Elec. Citing industry sources, The Elec revealed that the Samsung has halved the volume …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3D NAND, KrF, Photoresist, Samsung
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[News] Trump’s Tariff Storm Spurs Taiwan’s ASIC Firms to Seek Refuge in the U.S. Market
As Trump threatens to impose new tariffs on countries like Mexico, Canada and China, the storm is gradually impacting upstream players in the semiconductor industry. According to Commercial Times, Taiwan’s electronic manufacturing services (EMS) industry begins to feel headwinds, as …
[News] Japan, South Korea Reportedly Strive to Cut Dependence on China for Tech Materials
As Donald Trump threatens to impose tariffs on Chinese imports from his first day in office, how to reduce dependence on China’s tech materials becomes a top priority for Asian countries like Japan and South Korea, which are heavily involved …
[Insights] Lunar Lake Setback Exposes Intel’s Product Planning Problems
Intel has recently announced that it will discontinue integrating DRAM into CPU packaging following Lunar Lake (LNL). However, this actually reveals deeper issues: Intel’s crisis in product planning and organizational decision-making. TrendForce’s latest analysis points out that this setback is …