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Recent Posts
- [News] Can Tesla Stay Ahead? Musk’s $10 Trillion Dream Threatened by China’s Robotics Rise
- [News] Samsung Reportedly to Supply M14 Panels for All iPhone 17 Models, Becoming Apple’s Top OLED Supplier
- [News] Decoding SiCarrier: China’s Chip Tool Firm Set to Challenge Applied Materials and ASML
- [News] NVIDIA’s H20 Sales in China Threatened by Beijing’s New Green Rules, Revenue at Risk
- [News] BOE HC Semi’s Micro LED Factory Officially Delivers Products
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Meta
Daily Archives: 2025-03-25
[News] NVIDIA GB300 Ignites Supercapacitor Push Among Leading Taiwanese Suppliers
At GTC 2025, NVIDIA unveiled its latest GB300 server, which is expected to launch in the second half of 2025. According to Central News Agency, the integration of supercapacitor into its power system design has become a key highlight. The …
[News] Samsung Shifts to Sole CEO amid Struggles after Vice Chairman Han’s Sudden Passing
Following the sudden passing of Vice Chairman Han Jong-hee, Samsung Electronics has transitioned to a sole CEO system under Vice Chairman Jeon Young-hyun, replacing the previous dual CEO structure. The announcement was made today (25th), according to South Korean media …
[News] Intel Leadership Shift: Tan Charts Next Chapter, While Former CEO Gelsinger Embraces AI for Faith at Gloo
Both Intel’s newly-appointed and former CEOs are making new moves. Intel’s new CEO, Lip-Bu Tan, who succeeded Pat Gelsinger, is already taking early leadership steps. According to the company’s press release, Tan will deliver the opening keynote at Intel Vision 2025 …
[News] TSMC Gears Up for SoIC, Reportedly Secures Orders from NVIDIA’s Rubin After AMD and Apple
As TSMC preps for 2nm mass production in the second half of 2025, it is also accelerating advanced packaging expansion to meet strong demand, with a shifting focus beyond CoWoS. According to Commercial Times, NVIDIA’s next-gen Rubin GPU will join …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged AMD, Apple, CoWoS, Nvidia, Rubin, SoIC, TSMC
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[News] China’s SiCarrier Reportedly Eyes DUV Breakthroughs for 5nm, Debuting Products This Week
As China seeks to cut reliance on Western chipmaking machines such as extreme ultraviolet (EUV) lithography systems, the country has been pushing existing deep ultraviolet lithography (DUV) to its limits. According to Bloomberg and South China Morning Post, Huawei-linked SiCarrier …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 5nm, DUV, EUV, Huawei
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