Author Archives: ChloeWang

[News] Glass Substrate Mass Production is Nearing, with Tech Giants Leading the Way

Recently, Intel, AMD, Samsung, LG Innotek, and SKC’s US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Due to its excellent performance, glass substrate technology has become a rising star in the field of advanced …

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[News] HBM and Advanced Packaging Expected to Benefit Silicon Wafer

As artificial intelligence (AI) technology enjoys rapid advances, the demand for AI chips is skyrocketing, driving continuous improvements in advanced packaging and HBM (High Bandwidth Memory) technology, which is expected to benefit the silicon wafer industry. Recently, Doris Hsu, the …

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[News] Chip War Escalates: China to Enforce State Ownership of All Rare Earth Materials in October

The chip war between the U.S. and China keeps escalating, as China’s new regulation would reportedly take effect soon. This time it has a new target – rare-earth materials. According to the reports from Nikkei and Tom’s Hardware, the new …

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[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024

In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose …

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[News] Samsung Considers Hybrid Bonding a Must for 16-stack HBM

According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, …

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