Author Archives: TrendForce

[News] TSMC Faces Order Cut Fears as AMD, Broadcom, and NVIDIA Reportedly Slash CoWoS-S Demand

Ahead of TSMC’s earnings call on January 16th, market rumors have been circulating that the foundry giant’s largest clients are slashing their CoWoS-S orders. According to Commercial Times, AMD and Broadcom are reportedly releasing the CoWoS-S capacity they previously booked …

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[News] Micron Launches HBM Facility in Singapore as Samsung and SK hynix Expand Advanced Packaging Investments

Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. …

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[News] STMicroelectronics and GlobalFoundries Reportedly Halt French Wafer Plant Plans, Shift Focus to Chinese Market

According to a report from ijiwei, citing Bloomberg, previously in 2022 STMicroelectronics and GlobalFoundries announced a EUR 5.7 billion investment plan to construct a wafer fabrication plant in France. However, this joint venture project has since stalled. Meanwhile, ijiwei notes that …

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[News] Global Chipmakers Reduce Investments for 2nd Year in a Row as EV and Smartphone Demand Stalls

According to a report from MoneyDJ, citing Nikkei, global leading semiconductor companies have reduced their investment due to weak demand and overcapacity in semiconductors for electric vehicles (EVs) and smartphones despite the robust demand for AI-related semiconductors. Notably, this marks the second …

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[News] Apple Reportedly Nears Final Check on TSMC’s U.S.-made Chips, with 4nm Mass Production Imminent

A couple of days ago, U.S. Commerce Secretary Raimondo stated that TSMC has started the production of advanced 4nm chips in Arizona, as per Reuters. Now the information seems to get confirmed, as a latest Nikkei report notes that Apple …

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