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Author Archives: TrendForce
[News] JEDEC Releases New HBM4 Spec as Memory Giants Gear up to Take the Lead
As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week. …
[News] Huawei’s Largest Global R&D Center in Shanghai Unveiled, Invests Over USD 1.4 Billion
To overcome the restrictions from the US and its allies, China is said to be heavily investing in semiconductor development. According to a report from Liberty Times Net, Huawei has completed its “Lianqiu Lake R&D Center” with a total investment …
[News] TSMC Reportedly Sees Strong 4nm Demand, with NVIDIA’s Order Up by 25%
According to the industry sources cited in a report from Economic Daily News, TSMC is gearing up to start production of NVIDIA’s latest Blackwell platform architecture graphics processors (GPU) on the 4nm process. In response to the strong customer demand, NVIDIA …
[News] Equipment Manufacturers’ Global Race for Hybrid Bonding Opportunities
Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the …
[News] Korean Semiconductor Equipment Maker Develops ALD Technology to Reduce EUV Process Demand
Chul Joo Hwang, Chairman of South Korean semiconductor equipment company Jusung Engineering, recently stated that future semiconductors will stack transistors together, as the expansion of DRAM and logic chips has reached its limit. Stacking transistors like NAND is necessary to …