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Author Archives: TrendForce
[News] TSMC Reportedly Forms a Team on FOPLP Development, with Mini Line on the Road
With the surge in new applications like AI, advanced packaging remains a hot topic, particularly with FOPLP (Fan-Out Panel Level Packaging) technology gaining renewed attention. According to sources cited by a report from MoneyDJ, leading semiconductor foundry TSMC has officially …
Posted in Semiconductors, Wafer Foundries
Tagged advanced packaging, ASE Group, FOPLP, Innolux, Powertech, TSMC
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[News] JEDEC Releases New HBM4 Spec as Memory Giants Gear up to Take the Lead
As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week. …
[News] Huawei’s Largest Global R&D Center in Shanghai Unveiled, Invests Over USD 1.4 Billion
To overcome the restrictions from the US and its allies, China is said to be heavily investing in semiconductor development. According to a report from Liberty Times Net, Huawei has completed its “Lianqiu Lake R&D Center” with a total investment …
[News] TSMC Reportedly Sees Strong 4nm Demand, with NVIDIA’s Order Up by 25%
According to the industry sources cited in a report from Economic Daily News, TSMC is gearing up to start production of NVIDIA’s latest Blackwell platform architecture graphics processors (GPU) on the 4nm process. In response to the strong customer demand, NVIDIA …
[News] Equipment Manufacturers’ Global Race for Hybrid Bonding Opportunities
Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the …