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Author Archives: TrendForce
[News] Samsung Gains Early Market Entry Advantage in the Panel-Level Packaging Sector Ahead of TSMC
TSMC is said to be entering the fan-out panel-level packaging (FO-PLP) sector, according to a previous report from Nikkei. Now, a report from Business Korea noted that Samsung is making significant strides in the PLP field, as the tech giant …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged FOPLP, Samsung, TSMC
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[News] U.S. Expands Talent Training for Semiconductors from Taiwan, Japan, South Korea
The U.S. Department of Commerce announced on June 24 the expansion of SelectTalentUSA, a joint initiative with the Departments of Labor and Education. The program, designed to provide technical assistance to foreign businesses in delivering recruitment and training programs for …
[News] Rising HBM Production by Samsung and SK Hynix Energizes Korea’s TC Bonder Industry
Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by …
[News] Taiwanese AI Server Supply Chain to Benefit from Apple’s Potential Collaboration with Baidu and Alibaba
Due to restrictions on AI products’ usage in China, Apple is actively seeking Chinese partners to advance in the local AI application market. According to the latest report by the Economic Daily News, the tech giant has been engaged with …
Posted in Artificial Intelligence, Emerging Technologies
Tagged Alibaba, Apple, Baidu, Inventec
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[News] Leading IC Packaging and Testing Services Provider ASE Expands Globally Amid AI Demand
On June 21, ASE Group announced that ASE Semiconductor will collaborate with Hung Ching Construction to build a K28 plant in Kaohsiung. The project is expected to be completed in the fourth quarter of 2026 and will focus on end …