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Author Archives: TrendForce
[News] TSMC SoIC Expected to Gain Major Customer with Apple Ramp-Up in 2025
According to a report from Economic Daily News, TSMC’s advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client …
[News] TSMC’s Backside Power Delivery Reportedly Set for 2026, Benefiting the Supply Chain
As semiconductor manufacturing enters the Angstrom Era, there have been significant adjustments in architecture and circuit design. To free up more surface area on chips, moving power delivery to the backside has become a mainstream consensus, making the Backside Power Delivery …
[Insights] Memory Spot Price Update: DRAM Spot Price Finally Rises as Supply Tightens
According to TrendForce’s latest memory spot price trend report, the spot price of DRAM has finally seen a slight raise as supply for DDR4 and DDR5 tightens. Samsung has allocated more of its 1alpha nm production capacity to the manufacturing …
[News] Rise of the Non-NVIDIA Alliance Benefits Taiwanese ASIC Manufacturers
While NVIDIA is likely to face accusations from the French antitrust regulators, the Non-NVIDIA Alliance like the UALink (Ultra Accelerator Link) Alliance and the UXL Foundation are reportedly launching a counterattack, significantly increasing their efforts in developing specialized ASICs. According …
Posted in Consumer Electronics, Semiconductors
Tagged ASIC, CSP, CUDA, Egis Technology Group, Intel, Nvidia, Qualcomm, Silicon IP
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[News] Memory Market Recovery is Near, as Winbond Expects a Good Year in 2025
According to a report from Commercial Times, Arthur Chiao, Chairman of Winbond, stated that this upward market cycle for the memory sector has arrived on time. Reportedly, customers are not worried about shortages, and all products made by Winbond will …
Posted in Consumer Electronics, Semiconductors
Tagged AI, memory, NOR Flash, Taiwan, Winbond
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