Author Archives: TrendForce

[News] Jensen Huang Disclosed NVIDIA’s Plan for Establishing R&D Center in Taiwan, with at Least 1,000 Engineers Recruited

The 2024 Computex Taipei has kicked off, with NVIDIA CEO Jensen Huang delivering a speech on the industry’s prospects and future amidst the AI wave. According to a report from Commercial Times, during a media interview on the evening of …

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[News] Four Semiconductor Applicants for Taiwan’s Chip Act Tax Incentives – TSMC and MediaTek Expected to Benefit

The application period for the tax incentives under Taiwan’s Chip Act ended in late May. According to a report from the Economic Daily News, the Ministry of Economic Affairs announced on June 3rd that four semiconductor-related companies have applied, with …

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[News] ST to Build a New 8-Inch SiC Facility in Italy with EUR 5 Billion

On May 31, STMicroelectronics announced to build a new high-volume 200mm silicon carbide (SiC) facility in Catania, Italy, for power devices and modules as well as test and packaging. According to a report from WeChat account DRAMeXchange, the new plant aims …

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[News] Fueled by AI Demand, TSMC Targets its System-on-Wafer Manufactured with CoWoS to Enter Mass Production in 2027

At TSMC’s 2024 Technology Symposium in late May, Kevin Zhang, TSMC Senior Vice President of Business Development, has shared the company’s latest development on advanced packaging. This article recaps the highlights in the forum, featuring TSMC’s breakthroughs regarding advanced packaging. Advanced Packaging …

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[News] AMD Unveils MI325X, Claiming 30% Faster Computing Power than NVIDIA’s H200

AMD Chairman and CEO Lisa Su unveiled the company’s latest AI chip, MI325X, at the opening of Computex Taipei on June 3. She emphasized that the MI325X boasts 30% faster computing speed compared to NVIDIA’s H200. According to a report …

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