-
Recent Posts
- [News] U.S. Set to Ban AI Investments in China, with Rules Expected Soon
- [Insights] China’s Trade-In Policy and Production Cuts Halt TV Panel Price Decline in October
- [News] Global Rate-Cutting Cycle Begins, as Gold Prices Continue to Hit Record Highs
- [News] SiC and GaN Go Full Steam Ahead in Automotive Industry
- [News] Intel Explores Foundry Alliance with Samsung in High-Level Talks
Recent Comments
Archives
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Author Archives: TrendForce
[News] NVIDIA CEO Jensen Huang Announces the Latest Rubin Architecture – Rubin Ultra GPU to Feature 12 HBM4
NVIDIA CEO Jensen Huang delivered a keynote speech at the NTU (National Taiwan University) Sports Center on June 2. As per a report from TechNews, during the speech, he unveiled the new generation Rubin architecture, showcasing NVIDIA’s accelerated rollout of …
[News] BOE Reportedly Set to Close the Gap with Korea Competitors in OLED Panel Technology to One Year
Following its success in the LCD panel market, China’s BOE Technology Group has now been actively narrowing the technology gap with Korean giants in the organic light-emitting diode (OLED) panel domain. Citing industry experts, Business Korea reported that BOE has …
[News] Seven Fabs Might Face a Delay in Construction
In the past two years, the semiconductor industry has experienced a market downturn, a recovery slower than expected, and a cash crunch. Major companies such as Intel, TSMC, and Samsung, while continuing to advance their expansion projects, have been constantly …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged fab, Germany, Intel, Samsung, TSMC, US, Wolfspeed
Leave a comment
[News] Heated Competition Driven by the Booming AI Market: A Quick Glance at HBM Giants’ Latest Moves, and What’s Next
To capture the booming demand of AI processors, memory heavyweights have been aggressively expanding HBM (High Bandwidth Memory) capacity, as well as striving to improve its yield and competitiveness. The latest development would be Micron’s reported new plant in Hiroshima …
[News] Taiwan Ministry of Economic Affairs Reportedly Eyeing on Establishing a Semiconductor Park in Kyushu
On May 30th, Taiwanese Minister of Ministry of Economic Affairs, J.W. Kuo, proposed a crucial industry policy. According to a report from China Times, the first step is to take Taiwan’s manufacturing parks global, with the initial site planned for Kyushu, …