Author Archives: TrendForce

[News] NVIDIA CEO Jensen Huang Announces the Latest Rubin Architecture – Rubin Ultra GPU to Feature 12 HBM4

NVIDIA CEO Jensen Huang delivered a keynote speech at the NTU (National Taiwan University) Sports Center on June 2. As per a report from TechNews, during the speech, he unveiled the new generation Rubin architecture, showcasing NVIDIA’s accelerated rollout of …

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[News] BOE Reportedly Set to Close the Gap with Korea Competitors in OLED Panel Technology to One Year

Following its success in the LCD panel market, China’s BOE Technology Group has now been actively narrowing the technology gap with Korean giants in the organic light-emitting diode (OLED) panel domain. Citing industry experts, Business Korea reported that BOE has …

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[News] Seven Fabs Might Face a Delay in Construction

In the past two years, the semiconductor industry has experienced a market downturn, a recovery slower than expected, and a cash crunch. Major companies such as Intel, TSMC, and Samsung, while continuing to advance their expansion projects, have been constantly …

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[News] Heated Competition Driven by the Booming AI Market: A Quick Glance at HBM Giants’ Latest Moves, and What’s Next

To capture the booming demand of AI processors, memory heavyweights have been aggressively expanding HBM (High Bandwidth Memory) capacity, as well as striving to improve its yield and competitiveness. The latest development would be Micron’s reported new plant in Hiroshima …

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[News] Taiwan Ministry of Economic Affairs Reportedly Eyeing on Establishing a Semiconductor Park in Kyushu

On May 30th, Taiwanese Minister of Ministry of Economic Affairs, J.W. Kuo, proposed a crucial industry policy. According to a report from China Times, the first step is to take Taiwan’s manufacturing parks global, with the initial site planned for Kyushu, …

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