Author Archives: TrendForce

[News] SK hynix to Kick off Mass Production for GDDR7 in Q4 2024

SK hynix, as the market leader in HBM, targets to begin mass production of its GDDR7 chips in the fourth quarter of 2024, the company said on 13th June. In the meantime, Micron also announced the launch of its GDDR7 graphics …

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[News] MediaTek Reportedly Designing ARM-Based Chips for Microsoft’s AI PCs, Launch Expected by End of Next Year

According to sources cited in a report from Reuters, it’s said that IC design giant MediaTek is developing an ARM-based PC chip that will run Microsoft’s Windows operating system. Last month, Microsoft unveiled a new generation of laptops featuring ARM-based chips, which …

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[Insights] Memory Spot Price Update: China’s 618 E-commerce Promotions Provided Little Help for Market Demand; DDR5 Did Better in Sales

According to TrendForce’s latest memory spot price trend report, China’s 618 shopping festival has limited effects on demand, slowing down the digestion of existing inventory, causing DRAM and NAND Flash spot prices to slide further. However, DDR5 has been performing …

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[News] LG Display Reportedly Secures First Batch of Apple i16 Pro Max Panel Orders Ahead of its Competitor

The upcoming iPhone 16 series from Apple is set to debut in the latter half of the year, and according to a report from Korean media outlet “The Elec,” LG Display, a major panel manufacturer in South Korea, has secured OLED …

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[News] TSMC Accelerates CoWoS Advanced Packaging Capacity Construction, Beginning Equipment Procurement in its Chiayi Plant

With high demand for AI chips from major players like NVIDIA and AMD, the capacity for advanced packaging falls short of meeting demand. Industry sources cited in a report from the Economic Daily News indicate that TSMC’s new CoWoS facility …

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