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Author Archives: TrendForce
[News] Micron Reportedly Set to Build New DRAM Plant in Hiroshima, Japan, Operational Expected by End of 2027
According to a report from a Japanese media outlet The Daily Industrial News, it reported that Micron Technology plans to build a new plant in Hiroshima Prefecture, Japan, for the production of DRAM chips, aiming to begin operations as early …
[News] BOE Looking to Become OLED Panel Leader, Rumored to Have a 50% Capacity Expansion
Following its success in the LCD panel market, China’s BOE Technology Group plans to lead in the OLED panel sector as well. According to a report from Japanese media outlet Nikkei News on May 27th, BOE, China’s largest panel manufacturer, …
[News] Russia Reportedly Completed the Manufacturing of a Lithography Machine for 350nm Chip Production
According to foreign media reports on May 25, Russia’s first lithography machine has been completed and is currently undergoing testing. Vasily Shpak, Deputy Minister of Industry and Trade of the Russian Federation, pointed out that this equipment can ensure the …
[News] US Reportedly Expands Investigation into Applied Materials, Possibly due to Concerns of Shipments to SMIC
Applied Materials, the largest US semiconductor equipment manufacturer, has received subpoenas from the US Securities and Exchange Commission as well as the US Attorney’s Office of the District of Massachusetts in February, according to the latest report by Reuters. Citing sources …
[News] China’s Big Fund Phase Three Commences, Injecting 344 Billion RMB into Semiconductor Industry Growth
According to TianYanCha.com, the third phase of the National Integrated Circuit Industry Investment Fund Co., Ltd. has recently been established in China. The legal representative is Zhang Xin, with a registered capital of RMB 344 billion. The fund’s business scope …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged The Big Fund
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