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Author Archives: TrendForce
[News] NAND Flash Market Competition Intensifies, as SK Hynix, Samsung Strive to Meet AI Demand
As AI-related semiconductors has been driving the demand of High Bandwidth Memory (HBM), the NAND flash market now also feels the vibe. According to industry sources cited by Business Korea, the NAND Flash market competition is intensifying, while memory giants …
[News] Indian Software Company to Make Inroads into Chip Manufacturing
According to a report from global media Reuters, the Indian software company Zoho plans to invest USD 700 million in the chip manufacturing sector. Founded in 1996 and currently headquartered in Tamil Nadu, India, Zoho provides software and related services to …
[News] Intel to Adopt New High-NA EUV, High Costs Could Lead to Increased Losses
Intel’s early adoption of ASML’s High Numerical Aperture Extreme Ultraviolet Lithography (High-NA EUV) equipment is seen by many as a crucial move for Intel to reclaim its technological leadership. Yet, according to a report from CNA, industry sources cited in …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged ASML, EUV, High-NA EUV, Intel, TSMC
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[News] DRAM Price Surge Halts, Could HBM Demand Drive Price Increases?
The recovery in demand for PCs and smartphones will take time, leading to a halt in the upward trend of DRAM prices, remaining stable for two consecutive months. However, the rapid growth in demand for High Bandwidth Memory (HBM), essential …
[News] AMD Reportedly Seeks Major Subsidy with Four Conditions from Taiwan Ministry of Economic Affairs
As the era of AI advances, following NVIDIA’s application to the Ministry of Economic Affairs (MOEA) for the “A+ Industrial Innovative R&D Program,” which led to the establishment of the first R&D center in Asia and the creation of Taiwan’s …