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Author Archives: TrendForce
[News] Intel May Cut Gaudi 3’s 2025 Shipment Target by 30%, Raising Concerns for TSMC, ASE, and Alchip
To turn adversity around, Intel launched its latest AI accelerator, Gaudi 3, in late September. However, a report by the Economic Daily News indicates that the struggling giant has significantly slashed the chip’s shipment targets by over 30% for next …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged ALCHIP, ASE, Gaudi 3, Intel, TSMC
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[News] SK Hynix Set to Surpass Samsung in Q3 Profits Amid Booming HBM Sales
South Korea’s two major memory chip manufacturers, Samsung Electronics and SK Hynix, are set to release their Q3 earnings reports (July to September) at the end of the month, with Samsung Electronics also announcing its financial forecast on October 8. According …
[News] Samsung Starts Mass Production of Industry’s Most Powerful PC SSD for AI, Built with In-house 5nm Node
Samsung Electronics announced that it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity. According to Samsung’s press release, the PM9E1, which is built on its in-house 5nm-based controller and eighth-generation V-NAND …
[News] TSMC’s Electricity Demand Could Triple by 2030, Raising Concerns on Taiwan’s Power Supply
While TSMC is making advancements on its 2nm at full throttle, an unexpected risk may be emerging, which might be more severe than most could imagine: power supply. Citing a report by S&P, a report by Wccftech highlights that compared …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, EUV, Taipower, TSMC
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[News] Despite 3nm Issues, Samsung Plans to Speed up 2nm/1.4nm Expansion Next Year
Though still be struggling with low yield rates in 3nm, Samsung is reportedly ramping up its efforts to prepare for the mass production of 2nm and 1.4nm to compete with its longtime rival, TSMC. Citing industrial sources on Oct. 3rd, …