Author Archives: TrendForce

[News] Apple Unveiled M4 Chip for AI, Heralding a New Era of AI PC

On May 7 (The US time), Apple launched its latest self-developed computer chip, M4, which is integrated into the new iPad Pro as its debut platform. M4 allegedly boasts Apple’s fastest-ever neural engine, capable of performing up to 380 trillion …

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[News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei

The U.S. government has reportedly revoked the licenses of Intel and Qualcomm to supply semiconductor chips used in laptops and handsets to Huawei. According to Reuters citing sources, some companies received notices on May 7th, and the revocation of the licenses …

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[News] Intel Reportedly Collaborates with 14 Japanese Companies to Develop Semiconductor Backend Process Technology

According to a report from Nikkei News, US chip giant Intel will join forces with 14 Japanese companies to develop automation technology for “backend” semiconductor processes such as packaging. The aim is said to achieve automation by 2028, highlighting efforts …

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[Insights] Memory Spot Price Update: Buyer Shift to Spot Inquiries Due to DRAM Module Contract Price Increase

According to TrendForce’s latest memory spot price trend report, due to a significant increase in DRAM module contract prices, some buyers are turning to spot inquiries, leading to partial transactions at lower prices. Meanwhile, NAND Flash prices have shown loosening …

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[News] SK Hynix Plans to Manufacture 3D NAND over 400 Layers at -70°C with the Help of TEL

SK Hynix has been exploring the potential of manufacturing 3D NAND at ultra-low temperatures, which may enable the South Korean memory giant to produce its new-generation product with over 400 layers, South Korea’s media outlet TheElec revealed. According to the …

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