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Author Archives: TrendForce
[News] HBM Craze Continues! SK Hynix Reports Sold Out for this Year, Next Year’s HBM Capacity Nearly Fully Booked
SK Hynix CEO Kwak Noh-Jung announced on May 2nd that the company’s HBM capacity for this year has already been fully sold out, and next year’s capacity is also nearly sold out. From a technological perspective, SK Hynix plans to …
[News] AI Chip Alone Can’t Hold Up? AMD’s Fiscal Forecast This Quarter Reportedly Falls Short of Expectations
AMD benefited from AI demand last quarter (January to March), with revenue of USD 5.47 billion, surpassing Wall Street expectations and turning a profit compared to the same period last year. However, this quarter’s fiscal forecast and market outlook are …
[News] TSMC Advanced Packaging Crucial for AI Computing Power
The demand for AI computing power is skyrocketing, with advanced packaging capacity becoming key. As per a report from Commercial Times citing industry sources, it has pointed out that TSMC is focusing on the growth potential of advanced packaging. Southern …
[News] Going after TSMC? South Korea Allegedly Approves National-Level Advanced Packaging Development Plan
In a bid to catch up with leading players like TSMC, the South Korean government is said to have approved a national-level initiative aimed at actively promoting the development of advanced chip packaging technologies, according to a report from South Korean …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, CoWoS, HBM, Korea
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[News] Luxshare Reportedly Enters NVIDIA’s Chain, Eyeing at AI Chip Business
According to a report from Economic Daily News, Luxshare, a crucial player in the Chinese Apple supply chain, is said to be entering NVIDIA’s supply chain for the GB200, as it has announced the development of various components tailored for …