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Author Archives: TrendForce
[News] Chip to be the Game Changer in EV Market, Battery Becomes the Past
On April 24, Horizon Robotics, a Chinese autonomous driving solution provider, officially released six chips of Horizon Journey™ 6 series, supporting low, medium, and high-scale intelligent driving applications. Among them, the Journey 6E/M chips feature computing power of 80 TOPS …
Posted in Automotive Technologies, Emerging Technologies
Tagged China, EV, EV battery
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[News] Samsung Reportedly Signs USD 3 Billion HBM3e Deal with AMD
According to a report from Korean media outlet viva100, Samsung has signed a new USD 3 billion agreement with processor giant AMD to supply HBM3e 12-layer DRAM for use in the Instinct MI350 series AI chips. Reportedly, Samsung has also …
[News] Infineon Partners with Amkor to Establish Packaging and Testing Center in Portugal
To enhance the supply chain capabilities in Europe and strengthen outsourced backend manufacturing operations in the region, major automotive and power semiconductor manufacturer Infineon announced an expanded partnership with semiconductor packaging and testing services provider Amkor Techology. According to the …
[News] Chip Battle Escalates as China’s RISC-V Gains Traction, US Reportedly Examines National Security Risks
The US-China tech conflict has extended to RISC-V chips. Reuters reported on April 24th that the US Department of Commerce, in a letter dated around April 15th to members of Congress, highlighted concerns regarding China’s involvement in open-source RISC-V chip …
[News] TSMC Unveils 1.6nm Tech for the First Time, Production Set for 2026
TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 1.6nm, CoWoS, Silicon Photonics, TSMC
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