Author Archives: TrendForce

[News] Chinese Research Team Achieves New Breakthrough in Semiconductor Field

Recently, Professor Xu Xiaohong and Professor Wang Fang from Shanxi Normal University, in collaboration with Researcher Xue Dingjiang from the Institute of Chemistry, Chinese Academy of Sciences, reported a template selection strategy for bottom-up synthesis of CrSbSe₃ nanoribbons. They successfully …

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[News] Packaging and Equipment Firms Accelerate FOPLP Deployment: Spotlight on 7 Taiwanese Companies

The surging global demand for AI chips is straining advanced packaging capacity, driving a sharp focus on fan-out panel-level packaging (FOPLP) within Taiwan’s semiconductor industry. According to a report by Commercial Times, major packaging and testing firms such as ASE …

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[News] South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC

The competition between Samsung and TSMC has intensified not only in securing international IC design clients but also in the field of South Korean IC design companies. According to a report by ZDNet Korea, major South Korean AI semiconductor fabless …

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[News] TSMC Reportedly Mulls to Offer Discounts on Mature Nodes, Particular for 7nm/14nm Orders

While Taiwanese foundries are reportedly facing price pressure in mature nodes and are said to be offering discounts, TSMC is also rumored to mull about offering discounts to its customers on mature nodes, particular for 7nm and 14nm, a report …

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[News] XMC, Sister Company of YMTC, Has STAR Market IPO Application Accepted

On September 30, according to an announcement on the China Securities Regulatory Commission’s website, Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) has had its IPO application for the STAR Market officially accepted, marking the official start of its listing process. According …

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