Author Archives: TrendForce

[Insight] Key Takeaways on CES 2025: AI Innovations on Automotive Technologies and AI PC Advancements

CES 2025 officially commenced in Las Vegas, U.S., running from January 7 to 10 and featuring the latest innovations and products in consumer electronics. With participation from over 4,500 exhibitors worldwide (an increase from 4,300 in 2024), the event highlights …

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[News] Micron Kicks off Construction on HBM Advanced Packaging Facility in Singapore for HBM3E Products

Following Micron’s sequential doubling of HBM sales in the previous quarter, the U.S. memory giant is making strides in overseas expansion amid the AI boom. According to Micron’s press release, it breaks ground on a new HBM packaging facility in …

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[News] Jensen Huang: Samsung Requires a New Design for its HBMs to Pass NVIDIA’s Qualification

NVIDIA CEO Jensen Huang takes center stage again at CES 2025, as he unveiled several AI advancements in addition to the powerful GeForce RTX 50 GPU, built on its next-gen Blackwell architecture. Notably, he also made an update on Samsung’s …

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[News] Japan’s Renesas Electronics Plans Layoffs as Chip Demand Weakens

According to a MoneyDJ report, citing Nikkei, Japan’s leading automotive chip manufacturer, Renesas Electronics, is planning to lay off several hundred employees both domestically and internationally, while also reducing factory capacity utilization. As reported by Nikkei on January 7, Renesas …

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[News] Samsung’s Q4 Profit Expected at USD 4.5 Billion, Missing Expectations Due to Weak HBM Performance

Amid the AI frenzy at CES 2025, Samsung Electronics announced a lackluster fourth-quarter earnings guidance, which could be attributed to ongoing delays in obtaining NVIDIA’s approval for next-gen HBM products, according to Yonhap News and Reuters. As per Samsung’s press …

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