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Author Archives: TrendForce
[News] Going after TSMC? South Korea Allegedly Approves National-Level Advanced Packaging Development Plan
In a bid to catch up with leading players like TSMC, the South Korean government is said to have approved a national-level initiative aimed at actively promoting the development of advanced chip packaging technologies, according to a report from South Korean …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, CoWoS, HBM, Korea
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[News] Luxshare Reportedly Enters NVIDIA’s Chain, Eyeing at AI Chip Business
According to a report from Economic Daily News, Luxshare, a crucial player in the Chinese Apple supply chain, is said to be entering NVIDIA’s supply chain for the GB200, as it has announced the development of various components tailored for …
[News] Rumored Sharp Drop in H100 Server Black Market Prices in China Raises Concerns Over Market Stability
The recent rapid downturn in the black market prices of AI servers equipped with NVIDIA’s highest-tier AI chip, the H100, in China, has attracted attention, as per a report from Economic Daily News. This fluctuation, triggered by US sanctions, has …
[News] NVIDIA’s H100 Chip Heat Declines, CoWoS Capacity Eases
NVIDIA’s upcoming next-generation high-end AI chip, the H200, is on the horizon. As per a report from Economic Daily News, currently, the mainstream high-end H100 chip has seen a decline in demand, putting an end to the previous state of supply …
[News] Semiconductor Giants Continue to Invest in EUV Lithography Machine
As the competition in advanced semiconductor chip manufacturing industry heats up, EUV lithography machine has been sought after by the market, attracting great attention across the industry. Currently, Intel has taken the lead by purchasing ASML’s High-NA EUV lithography equipment …