-
Recent Posts
- [News] BOJ Holds Rates Steady, Yet Potential for Future Rate Hikes Grows
- [News] China’s Rising Display Industry May Face U.S. Sanctions Due to National Security Concerns
- [News] China’s Manufacturing Sees First Expansion in Nearly Six Months
- [News] Samsung Reportedly to Scale down Foundry Production, Shutting down 50% of Lines by Year-end
- [News] Apple Reports 6% Revenue Growth, Strong iPhone 16 Demand Amid Declining Sales in China
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Author Archives: TrendForce
[News] Intel’s Advanced Packaging Capacity Tightens, Affecting its AI PC Processor Supply in Q2
Per a report from TechNews, during Intel’s earnings call last week, CEO Pat Gelsinger stated that the supply of Core Ultra processors in the second quarter is limited due to insufficient wafer-level assembly capacity. Gelsinger mentioned in the meeting that with …
[News] Strengthening Controls on Semiconductor Equipment Exports to China, Japan Reportedly Tightens Export Control Measures Further
Japan is reportedly planning to expand export restrictions on four technologies related to semiconductors or quantum computing, as per a report from Bloomberg. This move is said to represent the latest initiative in global efforts to control the transfer of …
[News] Overseas Expansion of Testing and Packaging Facilities – Japan, Malaysia, and Singapore Emerge as Top Choices
As the global semiconductor landscape undergoes restructuring, major packaging and testing companies are actively establishing overseas advanced packaging capacities. According to a report from Commercial Times, semiconductor industry sources have indicated that, in terms of the clustering effect within the …
Posted in Semiconductors
Tagged China, Japan, Malaysia, semiconductor, Singapore, Taiwan
Leave a comment
[News] Following TSMC, ASE Reportedly Plans to Establish Plant in Kumamoto
Following TSMC’s announcement of investing USD 20 billion to build two plants in Kumamoto, Japan, industry sources cited by a report from Commercial Times has indicated that the major global semiconductor assembly and testing provider, ASE Group, is in discussions …
[News] Battle of the Titans in the Angstrom Era – TSMC’s A16 Competes with Intel’s 14A and Samsung’s SF1.4
TSMC unveiled its angstrom-class A16 advanced process during the Company’s 2024 North America Technology Symposium on April 25, set to be mass-produced in 2026. Not only is this earlier than competitors like Intel’s 14A and Samsung’s SF14, both slated for …
Posted in Semiconductors, Wafer Foundries
Tagged advanced process, Angstrom, Intel, Samsung, TSMC
Leave a comment