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Author Archives: TrendForce
[News] TSMC’s Advanced Processes Remain Resilient Amid Challenges
As TSMC’s earnings call approaches on April 18th, according to a source cited in a report from Commercial Times, it has predicted a downturn in the smartphone industry as it enters a slow season. However, TSMC is reportedly benefiting from AI demand, …
[News] While TSMC’s CoWoS Faces Supply Shortage, Samsung Reportedly Secures NVIDIA’s 2.5D Advanced Packaging Order
According to a report from South Korean media outlet TheElec, Samsung’s Advanced Package (AVP) team has reportedly secured an advanced packaging order for NVIDIA’s AI chip, paving the way for future supply of NVIDIA’s high-bandwidth memory (HBM) chips. The report, citing …
[News] TSMC’s Latest Statement Indicates Equipment Largely Recovered, Revenue Forecast Unchanged
According to TechNews, TSMC announced its latest updates on the evening of the 5th, stating that equipment within its Taiwan wafer fabs has largely recovered. The company’s full-year performance outlook, denominated in USD, is expected to remain consistent with the …
[News] After Taiwan’s Strong Earthquake, Latest Recovery Progress of Major Foundries
Taiwan experienced a magnitude 7.2 earthquake on the 3rd, prompting round-the-clock repair efforts during the holiday by semiconductor fabs, aiming to restore equipment operations. According to reports from TechNews, the latest progress of various fabs and science parks across different …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged earthquake, TSMC, UMC, VIS
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[News] Taiwan Earthquake Causes Partial Wafer Plant Equipment Shutdown, Limited Impact Expected
On the morning of the 3rd April, a Richter scale 7.2 earthquake occurred, shaking the entire Taiwan. Semiconductor wafer foundries were also disrupted, and relevant manufacturers have carried out emergency evacuations according to SOP. According to Money DJ, in response …