-
Recent Posts
- [News] BOJ Holds Rates Steady, Yet Potential for Future Rate Hikes Grows
- [News] China’s Rising Display Industry May Face U.S. Sanctions Due to National Security Concerns
- [News] China’s Manufacturing Sees First Expansion in Nearly Six Months
- [News] Samsung Reportedly to Scale down Foundry Production, Shutting down 50% of Lines by Year-end
- [News] Apple Reports 6% Revenue Growth, Strong iPhone 16 Demand Amid Declining Sales in China
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Author Archives: TrendForce
[News] Nikkei Highlights Japan’s Chip Subsidies Exceeding GDP Ratio of US, Germany, and France
According to a report by Nikkei News, Japan’s official support for the semiconductor industry expenditure, relative to its gross domestic product (GDP), is significantly higher than that of the United States and other major Western countries. Figures submitted by a …
[News] Japanese Photoresist Giant Shin-etsu Chemical Rumored to Build a New Plant
At the time when Japan is strengthening the construction of its semiconductor supply chain, as per a report from the Japan Times, Japanese photoresist giant Shin-Etsu Chemical is rumored to build a chip material plant in Gunma Prefecture, Japan, which …
[News] TSMC Reportedly Secures 4 Major Clients for SoIC, Including Apple, NVIDIA and Broadcom
Amid NVIDIA’s leadership in the AI wave, demand for CoWoS (Chip-on-Wafer-on-Substrate) has tripled, driving TSMC to aggressively expand CoWoS capacity, with a corresponding surge in demand for System-in-Integrated-Circuit (SoIC) solutions. According to a report from MoneyDJ citing industry sources, it …
Posted in Semiconductors
Tagged advanced packaging, Broadcom, CoWoS, Nvidia, SoIC, TSMC
Leave a comment
[News] Battle in AI PCs: Exploring Intel, AMD, and Qualcomm Chips’ AI Computing Power
The global laptop and PC market is experiencing a gradual recovery, driven by the growing trend of AI-powered PCs (AIPC). Consequently, as per a report from TechNews, the competition to enhance AI chip computing power has emerged as a key …
[News] TSMC Rumored to Appoint Higher-Level Executive to Accelerate Progress at U.S. Fab
As the U.S. Department of Commerce finalizes subsidies for Intel and TSMC, the two major semiconductor manufacturers will enter a new competitive landscape in the United States. In preparation for these new challenges and with the first fab trial production …