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Author Archives: TrendForce
[News] TSMC’s Latest Statement Indicates Equipment Largely Recovered, Revenue Forecast Unchanged
According to TechNews, TSMC announced its latest updates on the evening of the 5th, stating that equipment within its Taiwan wafer fabs has largely recovered. The company’s full-year performance outlook, denominated in USD, is expected to remain consistent with the …
[News] After Taiwan’s Strong Earthquake, Latest Recovery Progress of Major Foundries
Taiwan experienced a magnitude 7.2 earthquake on the 3rd, prompting round-the-clock repair efforts during the holiday by semiconductor fabs, aiming to restore equipment operations. According to reports from TechNews, the latest progress of various fabs and science parks across different …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged earthquake, TSMC, UMC, VIS
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[News] Taiwan Earthquake Causes Partial Wafer Plant Equipment Shutdown, Limited Impact Expected
On the morning of the 3rd April, a Richter scale 7.2 earthquake occurred, shaking the entire Taiwan. Semiconductor wafer foundries were also disrupted, and relevant manufacturers have carried out emergency evacuations according to SOP. According to Money DJ, in response …
[Insights] The Spot Price of DRAM Continues to Decline, Weak Trading Volume for NAND Flash
DRAM Spot Market: The current decline in spot prices is also one of the reasons for TrendForce’s relatively conservative forecast. Spot prices have been falling for several weeks. Apart from weak channel demand, TrendForce has also observed that memory module …
[News] Intel’s Chip Making Unit Lost $7 Billion Last Year; Foundry Unit Hits Loss Peak This Year
Intel revealed on the 2nd that its manufacturing business’s operational losses deepened, dealing a significant blow to Intel’s attempts to surpass TSMC and regain its leading position. According to Reuters, Intel stated that its manufacturing division incurred a $7 billion …