Author Archives: TrendForce

[News] Samsung Reportedly Establishes New HBM Team, Looking to Improve AI Chip Yield

Samsung Electronics Co. has recently established a HBM team within its memory division, with the goal of enhancing yield during the development of the sixth-generation AI memory HBM4 and the AI accelerator Mach-1. According to a report of the Korea Economic …

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[News] Japan and EU Reportedly Collaborate on Advanced Materials Research to Reduce Over-Reliance

Japan and the EU are reportedly set to launch formal cooperation in the research and development of advanced materials, such as chips and electric vehicle batteries. According to a report from NIKKEI, this initiative aims to decrease their high reliance …

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[News] UMC Rumored to Secure Major Chip Contract for New iPhone, Estimated to Produce Tens of Thousands of Units

UMC has reportedly received a contract to manufacture crucial chips for Apple’s upcoming iPhone antenna modules. According to a report from Economic Daily News, the production volume is said to be in the tens of thousands. Regarding this, UMC does …

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[News] With Rampant Plant Construction, TSMC Reportedly Expected to Revise Upward Capital Expenditure

The semiconductor battleground of the Angstrom Era has commenced earlier than expected, with TSMC advancing its plant expansions in Taiwan. As per Commercial Times citing sources, TSMC is poised to increase its 2024 capital expenditure from the initial estimate of USD 28-32 billion to …

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[News] Intel Unveils Two New GPUs, Manufactured on TSMC’s 4nm Process while Reportedly Targeting NVIDIA RTX 40 Series

According to wccftech, Intel’s new GPUs will come in two models, namely Battlemage-G10 (abbreviated as BMG-G10) and Battlemage-G21 (abbreviated as BMG-G21). These two new GPUs from Intel were revealed in an internal document. According to the document, the BMG-G10, targeted at …

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