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Author Archives: TrendForce
[News] AI Confronts an ‘Energy Crisis’? Electricity May Have Emerged as a Challenge
Could AI Be Heading Towards an “Energy Crisis”? Speculation suggests that a Microsoft engineer involved in the GPT-6 training cluster project has warned that deploying over 100,000 H100 GPUs in a single state might trigger a collapse of the power …
[News] Memory Manufacturers Vie for HBM3e Market
Recently, South Korean media Alphabiz reported that Samsung may exclusively supply 12-layer HBM3e to NVIDIA. The report indicates NVIDIA is set to commence large-scale purchases of Samsung Electronics’ 12-layer HBM3e as early as September, who will exclusively provide the 12-layer …
Posted in DRAM, Semiconductors
Tagged DRAM, HBM, HBM3e, Micron, Nvidia, Samsung, SK Hynix
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[News] Continued Slump in iPhone Demand in China – February Shipments Reportedly Plunge by 33%
In the Chinese market, demand for Apple’s iPhone continues to falter, with Bloomberg reporting a significant 33% drop in iPhone shipments in February compared to the same month last year. As per Bloomberg’s report on March 26th, despite China remains Apple’s most crucial overseas …
[News] SK Hynix Reportedly Plans to Invest USD 4 Billion in Advanced Packaging Fab in Indiana
SK Hynix is rumored planning to build an advanced packaging fab worth USD 4 billion in West Lafayette, Indiana. According to a report from The Wall Street Journal, it is expected to commence operations by 2028, creating up to 1,000 job opportunities. This …
Posted in Semiconductors
Tagged advanced packaging, Chip Act, HBM, HBM3e, SK Hynix, US
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[Insights] DRAM and NAND Flash Spot Prices Drop as Demand Weakens
DRAM Spot Market: DRAM spot prices continue to fall as channel demand has been tepid. Furthermore, the decline has become sharper recently for both DDR4 and DDR5 products. At the same time, spot traders who previously accumulated stockpiles are now …