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Author Archives: TrendForce
[News] Texas Instruments Plans Large-Scale Transition of GaN Chip Production from 6-inch to 8-inch Wafers
According to a report from Korean media outlet THE ELEC, a senior executive at analog chip manufacturer Texas Instruments (TI) stated that the company is transitioning its production of gallium nitride (GaN) chips from several 6-inch fabs to 8-inch fabs. …
[News] AMD Hosts Innovation Summit, CEO Lisa Su Highlights the Beginning of AIPC Era
Following NVIDIA’s GTC 2024, AMD also hosted an AI PC Innovation Summit on March 21st, with CEO Lisa Su leading the top executives in attendance. As per a report from Commercial Times, by collaborating with partners including brands ASUS, MSI, …
[News] Micron’s Financial Report Reveals High Demand for HBM in 2025, Capacity Nears Full Allocation
Micron, the major memory manufacturer in the United States, has benefited from AI demand, turning losses into profits last quarter (ending in February) and issuing optimistic financial forecasts. During its earnings call on March 20th, Micron CEO Sanjay Mehrotra stated …
[News] Samsung Reportedly Commits to Advanced Packaging, Targets Over USD100 Million in Related Revenue This Year
Amid the AI boom driving a surge in demand for advanced packaging, South Korean semiconductor giant Samsung Electronics is aggressively entering the advanced packaging arena. On the 20th, it announced its ambitions to achieve record-high revenue in advanced packaging this …
[News] MediaTek Partners with Ranovus to Enter Niche Market, Expands into Heterogeneous Integration Co-Packaged Optics Industry
MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This …