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Author Archives: TrendForce
[News] SMIC Likely to Continue Expanding Capacity Amid U.S.-China Tech Tensions
Chinese semiconductor foundries continue to expand production capacity under the pressures of the ongoing U.S.-China technology conflict, aiming to meet domestic demand. According to a recent TechNews report, a plot of land adjacent to Semiconductor Manufacturing Beijing Corporation has been …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged capacity expansion, SMIC
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[News] Applied Materials Faces $400M Revenue Loss as Part of Maintenance Services Halted in China
Export control headwinds are hitting the chip industry, with semiconductor equipment giant Applied Materials being one of the hardest struck. According to Bloomberg, the company has been forced to halt equipment maintenance services for some customers in China, leading to …
[News] TSMC Reportedly Advancing Groundbreaking for Third Arizona Fab to June
U.S. President Donald Trump has accused Taiwan of taking away America’s semiconductor business, putting the spotlight on how TSMC will respond. According to a report by Taiwan’s Central News Agency (CNA), market sources indicate that TSMC may accelerate its plans …
[News] China’s Three 10-Billion-RMB Semiconductor Projects Advance Progress
Recently, three major semiconductor projects worth tens of billions of RMB in Zhuhai, Kunshan, and Wuhan, China, have made significant progress. The Yiyuan Semiconductor Materials Industrial Base project in Jinwan District, Zhuhai, is expected to commence production in February 2026. …
[News] Financial Reports of Foundries Released: How Will TSMC, SMIC, and Hua Hong Plan for 2025?
In 2024, the foundry industry continued to advance amidst market fluctuations and technological innovations. Leading foundries such as TSMC, SMIC, and Hua Hong Semiconductor have all released their annual financial reports. Looking ahead to 2025, TrendForce predicts that the industry’s …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Hua Hong, SMIC, TSMC
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