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Author Archives: TrendForce
[Insights] Memory Spot Prices: NAND Flash Prices Edge Over DRAM Momentum
DRAM Spot Market: The spot market has not changed noticeably from the previous week and still lacks significant demand momentum. Therefore, spot prices of DDR4 and DDR5 chips have maintained a mostly flat to slightly downward trend. Module houses also …
[News] TSMC Supply Chain Delays US Fab Setup in Line with Chip Giant’s Pace
As TSMC and Intel slow down their plans for building fabs in the United States, the supply chain, according to a report from Nikkei Asia, is also said to delay in following suit, with semiconductor material suppliers like Topco Scientific, …
[News] From Technical Prowess to Integration Capability, TSMC and Intel Target Advanced Packaging to Seize Ecosystem Opportunities
Driven by the AI chip wave, “advanced packaging” emerges as the hottest technology in the semiconductor industry. Its significance extends beyond computational power demands, as the escalating cost of semiconductor processes and the limits of Moore’s Law make the “integration …
[News] Bulgaria Launches Renewables Energy & Storage Tenders
The Ministry of Energy in Bulgaria has launched 2 separate calls to build new renewable energy capacity and energy storage facilities in the country with more than BGN 535 million (roughly USD 298 million) budget. The BG-RRP-4.032 tender will support …
[News] Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible. According to a …
Posted in Semiconductors
Tagged 2.5D Packaging, 3D Packaging, 3D-IC, advanced process, chiplet, Heterogeneous Integration, SiP, SoC
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