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Author Archives: TrendForce
[News] Increasing Pressure on IDM 2.0 May Lead Intel to Delay or Abandon Investment Plans in Italy and France
In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction …
[News] TSMC’s 4nm Process Powers NVIDIA’s Blackwell Architecture GPU, AI Performance Surpasses Previous Generations by Multiples
Chip giant NVIDIA kicked off its annual Graphics Processing Unit (GPU) Technology Conference (GTC) today, with CEO Jensen Huang announcing the launch of the new artificial intelligence chip, Blackwell B200. According to a report from TechNews, this new architecture, Blackwell, …
Posted in Semiconductors
Tagged AI chip, Blackwell, GPU, GTC, HBM3e, Nvidia, SK Hynix
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[News] Global Silicon Carbide Production Expansion Steps up
Benefited from robust demand in downstream application markets, the silicon carbide (SiC) industry is in high gear. According to TrendForce, the SiC power device market is expected to reach USD 5.33 billion by 2026, with its mainstream applications still highly …
Posted in Semiconductors
Tagged Ascen Power, Mersen, Mitsubishi Electric, SiC, Silicon Carbide
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[News] TSMC Reportedly Considering Establishment of Advanced Packaging Facility in Japan
According to sources cited by Reuters, TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. …
[News] TSMC Boosts Investment in Advanced Packaging with NTD 500 Billion Plan to Build Six Plants in Chiayi Science Park
The Executive Yuan and TSMC have reportedly reached a consensus on the investment project for the new advanced packaging plant at the TSMC Science Park in Chiayi. According to a report from Economic Daily News, six new plant sites will …