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Author Archives: TrendForce
[News] Continuous Breakthroughs in SiC Substrates, Global 8-Inch Fab to Reach 11
In recent years, with the continuous surge in demand for Silicon Carbide (SiC) substrates, the call for cost reduction in SiC has been growing stronger, as the ultimate product price remains the key determinant for consumers. The cost of SiC …
[News] Intel Submits Conceptual Drawings for Fab Construction in Germany, Installing High-NA EUV Exposure Machines
In June 2023, leading processor manufacturer Intel reached an agreement with the German federal government, announcing the signing of an amended investment memorandum. The plan involves investing over EUR 30 billion to construct two new fabs in Magdeburg. The German …
[News] Dell Leak Reveals NVIDIA’s Potential B200 Launch Next Year
NVIDIA has yet to officially announce the exact release dates for its next-generation AI chip architectures, the Blackwell GPU, and the B100 chip. However, Dell’s Chief Operating Officer, Jeff Clarke, recently revealed ahead of schedule during Dell’s Q4 2024 Earnings …
[News] NVIDIA Reportedly Overwhelms TSMC with 3 and 4-Nanometer Orders
The annual AI event, NVIDIA GTC (GPU Technology Conference), is set to take place on March 17th, as H200 and the next-generation B100 will reportedly be announced ahead of schedule to seize the market. According to Commercial Times’ report citing …
[News] SK Hynix Rumored to Propose Collaboration with Kioxia for HBM Production in Japan
South Korean memory giant SK Hynix is reportedly exploring a collaboration with Japanese NAND flash memory manufacturer Kioxia to produce High Bandwidth Memory (HBM) for AI applications, as per MoneyDJ citing Jiji Press. According to Jiji Press’ report on March 1st, it is …