Author Archives: TrendForce

[News] Latest Overview on TSMC’s Global Expansion Initiatives

2020 was undoubtedly a milestone year in the development of TSMC, the leading semiconductor foundry. According to a report from TechNews, TSMC’s global expansion has reached locations in China, the United States, Japan, and Germany, solidifying its goal of being …

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[News] SK Hynix Announces Complete Sales of HBM for the Year, Memory Market Poised for Recovery

South Korean memory giant SK Hynix has confirmed record-breaking sales of High Bandwidth Memory (HBM) over the past few months, driving profitability in the fourth quarter and predicting an industry-wide recovery. According to Wccftech, SK Hynix Vice President Kim Ki-tae stated on …

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[News] UMC Seamlessly Integrates Key 12-Nanometer Technology as Intel Joins Forces

As Intel’s January announced the collaboration with UMC on the 12-nanometer process platform, UMC’s Co-General Manager, Jason Wang, led a team to support Intel’s IFS event. Cited by Commercial Times in its report, Wang emphasized that UMC’s existing customers would have …

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[News] Gelsinger Opens Up, as Intel Reportedly Expands Orders to TSMC

Pat Gelsinger, CEO of Intel, announced on February 22nd that Intel will expand its orders to TSMC, as per a report by Commercial Times. Following the IFS Direct Connect event in San Jose, USA, Gelsinger pointed out in an interview that two generations …

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[News] TSMC’s Latest Advancements in CFET, 3D Stacking, and Silicon Photonics

Kevin Zhang, Senior Vice President of Business Development at TSMC, introduced the company’s latest technologies at the International Solid-State Circuits Conference (ISSCC) 2024. According to TechNews citing from the speech, Zhang shared insights into future technological advancements, prospects for advanced …

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