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Author Archives: TrendForce
[News] Intel’s Turnaround Hinges on This? Its First 18A Chip in High-volume Makes Official Debut
Amid an operational crisis, Intel has abandoned its “5 Nodes in 4 Years” plan, shelving the Intel 20A process node to focus entirely on the more advanced Intel 18A. Now, there is finally good news regarding the 18A process. During …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged 18A, 5 Nodes in 4 Years
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[News] TSMC Teams up with Ansys and Microsoft to Achieve 10X Faster Silicon Photonics Simulations
With silicon photonics emerging as a key enabler in the AI era, semiconductor giants have been accelerating their deployment in the technology. Now TSMC announces its latest breakthrough. According to a press release, by collaborating with EDA solution provider Ansys, …
[News] PSMC and Tata Electronics Finalize Partnership on 12-Inch Wafer Fab
Powerchip Semiconductor Manufacturing Corp. (PSMC) announced on the 26th that it has signed a definitive agreement with Tata Electronics in New Delhi to collaborate on building India’s first 12-inch wafer fab in Dholera, Gujarat. PSMC will transfer mature process technologies …
[News] U.S. Official Denies Samsung Layoff Rumors at Taylor, Describing it as Routine Rotations
As rumors indicate that Samsung plans to withdraw personnel from its USD 40 billion Taylor, Texas plant, a recent report by The Korea Herald dismisses the speculation. Citing a local economic development chief, the report notes that construction is on …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Samsung, Taylor Plant
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[News] China’s IC Exports Regain Momentum, Amounting to RMB 736 Billion by August
Recently, a report by People’s Daily notes that according to data released by China’s customs authorities, in the first eight months of this year, China’s integrated circuit (IC) exports amounted to RMB 736.04 billion, an increase of 24.8%. IC exports …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged China, IC
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