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Author Archives: TrendForce
[News] Samsung Bullish on Glass Substrate Applications, Setting Up Production Line for Mass Production Starting in 2026
Samsung, as per a report from the global media outlet wccftech, has decided to enter the next generation of packaging technology by commencing R&D works for the adoption of “Glass Substrate” by 2026. The report further indicates that Samsung’s preparation to enter the …
[News] South Korean Government Considering Cooperation with U.S. on Semiconductor Equipment Export Controls against China
As the pressure from the United States to strengthen export controls on semiconductor manufacturing equipment to China continues to grow, as per a report from Yonhap News Agency (YNA), the United States has reportedly urged allies such as Japan, the …
[News] Salvaging HBM Yield, Samsung Follows Competitors by Adopting SK Hynix’s Techniques
There are market rumors suggesting that Samsung Electronics plans to switch to the chip manufacturing technology used by SK Hynix in an effort to catch up with competitors in the increasingly heated competition of high-bandwidth memory (HBM). As per Reuters’ …
[News] US Chip Supply Chain’s Expansion into the Philippines Nears?
In recent years, influenced by complex international dynamics and the need to safeguard supply chain security, Southeast Asian countries such as Singapore, Malaysia, and Vietnam have become prime locations for numerous semiconductor giants to establish overseas operations. Now, the Philippines …
[News] Intel Rumored to Temporarily Retain Chip Supply License to Huawei, While AMD Awaits Response
Intel has reportedly retained the export licenses that would have prohibited them from selling laptop processor (CPU) chips to the Chinese telecommunications giant Huawei. This signifies that Intel has temporarily preserved its business of providing chips worth hundreds of millions of …