-
Recent Posts
- [News] Japan’s Rapidus to Receive First EUV in mid-December, with ASML Planning Service Center Nearby
- [News] TSMC Reports Progress on Arizona Fab, No Completion Ceremony Planned
- [News] China’s Leading Chip Packaging Firm JCET Unveils Major Board Restructuring
- [News] Intel Israel Reportedly Sees Departure of Over 1,000 Employees amid Major Layoffs
- [News] China’s AI Unicorn Moore Threads, Domestic Competitor to NVIDIA, Kicks off IPO Process
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- DataTrack-EN
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Market Today
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Author Archives: TrendForce
[News] TSMC Reportedly Doubles CoWoS Capacity while Amkor, ASE also Enter Advanced Packaging for AI
The surge in demand for advanced packaging is being primarily propelled by artificial intelligence (AI) chips. According to industry sources cited by CNA, TSMC’s CoWoS production capacity is set to double this year, yet demand continues to outstrip supply. In …
[News] SoftBank Founder Masayoshi Son Plans to Raise USD 100 Billion to Establish AI Chip Company
SoftBank Group founder Masayoshi Son, as per a report from Bloomberg, is planning to raise USD 100 billion to establish an AI chip company, aiming to complement the group’s ARM business. The report indicates that Masayoshi Son plans to name the …
[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities
With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, ASE Group, CoWoS, GPU, HBM, Nvidia, TSMC, UMC, winbo
Leave a comment
[News] High Efficiency in TSMC Kumamoto Plant Construction Sets Stage for Potential Advanced Packaging Investment in Japan
Industry sources cited by the Liberty Times Net have pointed out that the Kumamoto plant holds significant importance for both Taiwan and Japan, as Japan is expected to look for attracting investments from TSMC, Intel, and Samsung to establish manufacturing …
Posted in Semiconductors
Tagged advanced packaging, Japan, Kumamoto, semiconductor, TSMC
Leave a comment
[News] Financial Reports of Six Major Foundries Reveal Semiconductor Industry Recovery Status
The latest financial reports for 4Q23 from six leading global semiconductor foundries signal optimism for the semiconductor industry’s recovery in 2024. In 2023, the semiconductor sector underwent significant adjustments. As the industry worked towards normalizing its inventory levels amidst ongoing …
Posted in Semiconductors
Tagged foundry, GlobalFoundries, Intel, Samsung Electronics, TSMC, UMC
Leave a comment