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Author Archives: TrendForce
[News] SK Hynix Begins Mass Production of 12-Layer HBM3E, Shipping to Start This Year
SK Hynix announced today that it has commenced mass production of the world’s first 12-layer HBM3E product with 36GB of capacity, the largest for any HBM currently available, according to the company. SK Hynix stated that it plans to deliver …
[News] Two Major Chinese Firms Launch Billion-Dollar Advanced Packaging Projects: How Are Global Giants Progressing?
Driven by the massive demand for AI chips, advanced packaging is in short supply, and the development of three major advanced packaging technologies CoWoS, SoIC, and FOPLP is booming. In addition, two major billion-dollar projects in China have made recent …
Posted in IC Manufacturing, Package&Test, Semiconductors, Wafer Foundries
Tagged advanced packaging
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[News] Foxconn Mulls to Invest USD 1 Billion in India to Assemble Smartphone Display Modules for Apple
Earlier in August, Foxconn announced the plan to expand its overseas investments, with the total amounting to roughly USD 840 million. Now the expansion plan seems to be more materialized, as the Taiwanese tech giant is reportedly evaluating an investment …
[News] South Korea Said to Heavily Rely on China for Critical Semiconductor Materials such as Silicon
While South Korean memory giants Samsung Electronics and SK hynix saw their sales in China double in the first half of this year, the country as a whole seems to heavily rely on China for essential semiconductor raw materials as …
Posted in DRAM, IC Manufacturing, Package&Test, NAND Flash, Semiconductors
Tagged China, Gallium, Samsung, Silicon
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[Insights] Memory Spot Price Update: NAND Contract Prices for Q3 Shows Signs of Loosening, Likely to Persist until Q4
According to TrendForce’s latest memory spot price trend report, regarding DRAM, reball DDR4 and DDR5 chips stripped from modules continue to flow into the spot market, adversely affecting the market outlook. As for NAND flash, contract prices for 3Q24 have …