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Author Archives: TrendForce
[News] Intel CEO Claims China’s Chip Manufacturing Lags Behind by 10 Years, Gap to Persist
According to the report from TechNews, Intel CEO Pat Gelsinger, speaking at the World Economic Forum, stated that export sanctions from the United States, Japan, and the Netherlands are temporarily limiting China’s development in semiconductor processes below 7 nanometers. Despite …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged China's semiconductor, Intel
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[News] TSMC Actively Increases 2-Nanometer Production Capacity Planning, Market Expects Explosive Demand
TSMC announced during its briefing on the 18th that, due to robust demand in the 2-nanometer market, it plans to add another fab to the initially planned two fabs in Kaohsiung. The company intends to use the 2-nanometer process for …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 2nm, High-NA EUV, Intel, TSMC
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[News] TSMC’s Overseas Investments on Track; Kumamoto Plant Opening on 2/24
TSMC Chairman Mark Liu discussed TSMC’s global expansion during earnings conference yesterday, stating that progress in the construction of TSMC’s facilities in Japan, the United States, and Germany will proceed according to the original plans. The Kumamoto facility in Japan …
[News] TSMC Earnings Conference: Q1 Revenue Estimated to Drop 6.2%, Expects Over 20% Annual Growth
TSMC reported its Q4 2023 financial results, disclosing consolidated revenue of NT$625.53 billion, net income of NT$238.71 billion, and diluted earnings per share of NT$9.21 (US$1.44 per ADR unit). The figures show a flat year-over-year performance in revenue, with a …
[News] TSMC’s SoIC Demand Heats Up, Reports Suggest Significant Capacity Expansion
In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, CoWoS, SoIC, TSMC
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