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Author Archives: TrendForce
[News] RBA Holds Monetary Policy Steady, Interest Rates Remain at 12-Year High
The Reserve Bank of Australia (RBA) announced on September 24 that the cash rate target remain at 4.35%, marking the seventh consecutive month at this level, which is also the highest in nearly 12 years. In the meeting statement, the …
[News] GUC Announces HBM3E IP Adoption by Multiple CSPs and Successful Collaboration with Micron
Global Unichip Corp. (GUC), a leading provider of advanced ASIC solutions, announced that its 3nm HBM3E Controller and PHY IP have been adopted by a major cloud service provider and several high-performance computing (HPC) companies. The cutting-edge ASIC is expected …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged HBM3e, HBM4
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[News] Kioxia Reportedly Cancels IPO Plan Next Month, Possibly Delaying It until November
A month ago, Kioxia has reportedly submitted its initial public offering (IPO) application to the Tokyo Stock Exchange. However, as the memory market recently seems to be on a roller coaster ride, the latest report by Reuters notes that the …
[News] Latest Updates on 6-Inch Production Lines for Third-Generation Semiconductor
Recently, several 6-inch production lines have made significant advancements, focusing on third-generation semiconductor materials like silicon carbide (SiC) and gallium oxide (Ga2O3). NEXIC Successfully Completes First Wafer Batch in Its Fab On September 21, NEXIC announced that it had successfully …
[News] U.S. and India Plan New Semiconductor Plant in India, Vietnam Sets 2050 Development Blueprint
According to The Hindu, India, under a transformative partnership with the U.S., is set to establish its first national security semiconductor fabrication plant. This facility will produce chips for military hardware in both nations, as well as for critical telecommunications …