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Author Archives: TrendForce
[News] Bezel-Less iPhone on the Horizon? LG Innotek Rumored to Develop Under-Panel Camera
In the pursuit of a larger screen-to-body ratio, smartphones adopting a “bezel-less” design have become a trend. According to a report from the Korean media outlet “The Elec,” rumors in the market suggest that Apple’s iPhone 17 Pro, expected to be …
[News] Resolution of Labor Dispute Paves the Way for Accelerated Equipment Installation at TSMC’s US Fab
The labor dispute sparked by TSMC’s venture into the United States is poised to come to a close. TSMC’s Arizona plant and the local labor union, Arizona Building and Construction Trades Council (AZBTC), announced an agreement yesterday. TSMC will collaborate …
[News] TSMC President Highlights 2024 Semiconductor Challenges While Envisioning Abundant AI Opportunities
On the 7th, TSMC convened the 2023 Supply Chain Management Forum, C.C. Wei, President of TSMC, acknowledging persistent inflationary pressures, remains optimistic about 2024. He also cited the rapid growth of AI applications as a key driver of opportunities, reported …
[Insights] Chinese Government Invests in Huawei Supply Chain; Semiconductor Self-sufficiency for China’s Long-Term Growth
Bloomberg reported in early December 2023 that the Chinese government has been directly investing to assist Huawei in building its chip supply chain since 2019, indicating that the ongoing uncertainties in the U.S.-China trade war, the pursuit of semiconductor industry self-sufficiency …
[News] Memory Titans Vie for Control in HBM Tech, Who Will Shape the Next-Gen?
Market reports suggest Nvidia’s new product release cycle has shortened from two to a year, sparking intense competition among major memory companies in the realm of next-gen High Bandwidth Memory (HBM) technology. Samsung, SK Hynix, and Micron are fervently competing, …
Posted in DRAM, Semiconductors
Tagged HBM, HBM3, HBM4, Micron, Samsung, SK Hynix, TSMC
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