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- [News] Thinnest iPhone Ever to Launch Next Year with a Rumored 6mm Thickness, Powered by TSMC’s 3nm Node
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Author Archives: TrendForce
[News] Big Fund II Infuses HLMC with an Additional USD 1 Billion, Potentially Eyeing on More Advanced Processes
The investment momentum of China’s Big Fund Phase II shows no signs of slowing down, with its latest investment directed at Shanghai Huali Microelectronics Co., Ltd. (HLMC), a subsidiary of Huahong Group. According to Sina Finance’s report, this substantial investment …
[News] AMD Unveils Ryzen 8040 Series AI Processor Utilizing TSMC’s Advanced 4nm Process
AMD announced the Ryzen 8040 series processor at the AMD Advance AI event. With TSMC’s advanced 4nm process, this new processor boasts up to a 1.6x improvement in AI processing performance compared to its predecessor. From AMD’s press release, the …
[News] Price Talks Every Week! Western Digital Notifies Customers of Weekly Price Adjustments
Memory prices continue to rise, with the world’s top five memory chip manufacturers, including Western Digital (WDC), notifying their distributors and consumer customers on December 5th that they will shorten the quoting period for their two major products – HDD …
[News] Samsung Boosts 2.5D Packaging Equipment to Compete for TSMC’s CoWoS Orders
Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC’s advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 2.5D Packaging, CoWoS, Samsung, Shinkawa, TSMC
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[News] Can Mini LED Overcome Challenges Post-Apple’s Shift? Explore Its Prospects Beyond Apple’s Favor
In the past few years, the rapid growth of the Mini LED backlight market has been closely tied to the support from consumer electronics giant Apple. Apple pioneered the integration of Mini LED backlight technology into tablet products, sparking increased …