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Author Archives: TrendForce
[New] Seven Chinese Chip Design Companies You Need to Know—All Aiming to Replace Nvidia
As the U.S. and its allies continue to impose technology restrictions on China’s semiconductor sector, Beijing has accelerated its efforts to develop homegrown alternatives. Chinese firms are aggressively pursuing advanced AI chip development, aiming to rival Nvidia, the global leader …
[News] Intel Moves Integrated Photonics Solutions to Data Center AI Division as Part of Restructuring Plan
While all eyes are on Intel’s restructuring plan, which features the foundry unit’s spin-off and the delay of Germany and Poland factories, there is another critical decision regarding its photonics business. According to Intel’s announcement, the tech giant is moving …
Posted in Artificial Intelligence, Emerging Technologies, IC Design, Semiconductors
Tagged Intel, Silicon Photonics
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[News] Huawei Might Not Hold the Crown for Long as Xiaomi Tries to Catch up on Tri-fold Smartphones
Huawei’s Mate XT, being the world’s first tri-fold smartphone, has created a buzz as it got over 4 million preorders even before the formal launch. However, the tech giant might not enjoy the monopoly for long. Citing a recent patent …
Posted in Consumer Electronics, Smartphones
Tagged Huawei, Mate XT, tri-fold, Xiaomi
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[Insights] China’s MIIT Unveils Latest Domestic DUV Equipment, Faces Challenges for 40nm Processes
On September 9, 2024, China’s Ministry of Industry and Information Technology (MIIT) released the “Guiding Catalog for the Promotion and Application of Major Technical Equipment (2024 Edition),” listing 286 domestically manufactured equipment items. Among these, the KrF and ArF lithography …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged ArF lithography machine
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[News] TSMC Reportedly Begins Small-Scale Production in Arizona for Apple’s A16 with the N4P Node
In early September, rumors have it that TSMC’s first US fab in Arizona began producing engineering wafers using the 4nm process in April, with yields reportedly comparable to those manufactured in its Southern Taiwan Science Park facility. Now here’s the …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged A16, Apple, Arizona, Intel, Samsung, TSMC
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