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Author Archives: TrendForce
[News] Samsung Reportedly Poised for Major Overhaul of Advanced Packaging Supply Chain amid HBM Race
Has the elephant started dancing? In addition to the reshuffle of its semiconductor executive team in November, Samsung is reportedly set to significantly revamp its supply chain for advanced semiconductor packaging, as per a report from South Korean media outlet …
[News] SK hynix Gears up for 16H HBM3E Mass Production in 2025, with Early Testing Showing Positive Results
In early November, SK hynix CEO Kwak Noh-Jung introduced the world’s first 48GB 16-high HBM3E at SK AI Summit in Seoul. Now, before the year 2024 draws to an end, the HBM giant is gearing up for the mass production …
[Insights] Memory Spot Price Update: DRAM Demand Slows Amid Year-End Inventory Checks, as Server RDIMMs Hold Strong
According to TrendForce’s latest memory spot price trend report, regarding DRAM, with year-end inventory checks being carried out, many buyers have halted procurement, with only sales of server RDIMMs remaining strong. As for NAND flash, overall spot market prices are …
[News] Intel Reportedly to Unveil New Arrow Lake Configurations at CES 2025; 18A Update Also Expected
After confirming to build Panther Lake with its own 18A node, Intel may have more good news to be announced at the upcoming CES 2025. According to the reports from TechPowerUp and Wccftech, Team Blue is expected to highlight on …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 18A, Arrow Lake, CES, Intel
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