Author Archives: TrendForce

[News] Intel Reportedly Sought Commerce Secretary Raimondo’s Help over U.S. Reliance on TSMC

In a last-ditch effort before the upcoming board meeting this week, Intel is said to be seeking assistance from the U.S. government. The latest report by CNBC notes that Intel CEO, Pat Gelsinger, turned to Commerce Secretary Gina Raimondo recently, …

Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , | Leave a comment

[News] Latest Development on AI Models of China’s Top Techs: Alibaba, Baidu, ByteDance, Huawei and Tencent

With AI giants in the Western world, such as OpenAI, Google and Meta, stealing the spotlight by their development of generative AI, some big names in China have introduced their AI models over the past 18 months, according to a …

Posted in Artificial Intelligence, Emerging Technologies | Tagged , , , , , , , , , , | Leave a comment

[News] AI Server and Humanoid Robot, New Drivers for GaN Industry

In recent years, data center has been one of the key areas for GaN (Gallium Nitride) manufacturers to tap power electronics market, and GaN applications in the data center power supply market have taken a big step forward. Notably, the …

Posted in Artificial Intelligence, Emerging Technologies, Semiconductors | Tagged , , , | Leave a comment

[News] Loongson Zhongke Technology Claims Next-Generation Processor Performance “World Leading,” Set to Debut in 2H25

At its 2024 semi-annual results briefing, Loongson Zhongke Technology announced that the 3B6600 processor is expected to begin sampling in the first half of next year and be officially released in the second half. Per a report from IThome, Chairman …

Posted in Semiconductors | Tagged , , , | Leave a comment

[News] ACM Research Launches Panel-Level Etching Tool, Expanding Its FOPLP Porfolio

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This …

Posted in Semiconductors | Tagged , , , , , , , , , | Leave a comment