Author Archives: TrendForce

[News] Intel’s 18A Reportedly Runs into Trouble with Broadcom, while 20A Plan on Arrow Lake Cancelled

Posted on 2024-09-05 by TrendForce

Disappointing financial results. A 15% layoff of its workforce. Restructuring and cost-reduction plans which may include the sale of FPGA unit Altera and freezing its USD 32 billion German fab project. Now, there seems to be more bad news on …

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Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , | Leave a comment

[News] SK hynix to Begin 12-Stack HBM3e Mass Production, Marking Key Moment in HBM Battlefield

Posted on 2024-09-05 by TrendForce

SK hynix President Justin Kim shared insights on SK hynix’s current memory products and HBM-related offerings in a speech titled “Unleashing the Possibilities of AI Memory Technology.” Per a report from TechNews, he announced at Semicon Taiwan that the company would …

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Posted in DRAM, Semiconductors | Tagged , , , , , , , , , | Leave a comment

[News] Bank of Canada Cuts Rates Again, Indicating a Larger Cut Possible if Economic Condition Worsens

Posted on 2024-09-05 by TrendForce

The Bank of Canada (BoC) announced a 25 basis point rate cut on September 4, in line with market expectations, marking the BoC’s third consecutive rate cut since June. The BoC noted that CPI growth across its components has returned …

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[News] Samsung Reportedly Faces Yield Issues Regarding 1b DRAM Used in Galaxy S25

Posted on 2024-09-05 by TrendForce

As Samsung plans to unveil its next-gen flagship smartphone, Galaxy S25 series, in early 2025, more details regarding the product have surfaced. Months ahead of the launch, Samsung is said to abandon the dual-processor strategy and equip the entire series …

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Posted in Consumer Electronics, DRAM, Semiconductors | Tagged , , , | Leave a comment

[News] FCBGA Sector Seems to Burgeoning with the Engagement of More Players

Posted on 2024-09-05 by TrendForce

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip …

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