Author Archives: TrendForce

[News] Applied Materials Receives Subpoena from U.S. Department of Justice, Faces Further Scrutiny

According to a report from Bloomberg, Applied Materials Inc. pointed out that the U.S. Department of Justice (DOJ) has requested information regarding its federal grant applications, further intensifying the government’s investigation into the company’s operations. Per a regulatory filing last …

Posted in Semiconductors | Tagged , , , , , | Leave a comment

[News] China Established a New Platform for Developing Chip Industry

Recently, the Future Chip Innovation Research Institute of Xiong’an New Area was officially established in Hebei, China. According to the official Wechat account of “Xiong’an New Area,” the Future Chip Innovation Research Institute of Xiong’an New Area was jointly founded …

Posted in Semiconductors | Tagged | Leave a comment

[News] “Black Myth: Wukong” Sparks Trend, Boosts Demand for Memory and Graphics Cards

China’s debut AAA game, Black Myth: Wukong, has achieved remarkable success just four days post-launch. The game has sold over 10 million copies on Steam alone, with peak simultaneous online players reaching 3 million. Priced around NT$1,280 per copy, its …

Posted in Consumer Electronics, DRAM, Semiconductors | Tagged | Leave a comment

[News] Japan Core CPI Picks Up, Market Expects Another Rate Hike by Year-End

The Japanese Ministry of Internal Affairs and Communications (MIC) released the consumer price data on August 22, showing that the July CPI increased by 2.8% year-over-year, the same as the previous month, and slightly above market expectations by 0.1%. This sustained …

Posted in Macroeconomics | Tagged , | Leave a comment

[News] TSMC Secures $1.96 Billion in Subsidies for Japan and China Plants

TSMC is accelerating its global expansion, receiving robust support from governments in Japan and China. In the first half of this year alone, TSMC secured nearly NT$8 billion in subsidies from the two countries, bringing its total government aid from …

Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , | Leave a comment