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Author Archives: TrendForce
[News] China’s Import of Chip Making Equipment Hit New High This Year, with Mature Nodes Driving the Demand
China has turned itself into “the world’s market” for semiconductor, while it eyes to play a crucial role in chip manufacturing by procuring more equipment. The latest reports by Bloomberg and Technews, citing data from China’s General Administration of Customs, indicates …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged ASML, China, chip war, EUV, SMIC
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[News] Rebellions Accelerates Next-Gen AI Chip Production, Featuring Four Samsung HBM3e
According to a report from Korean media outlet BusinessKorea, Rebellions’ CTO Oh Jin-wook announced that the company will adjust its production plans, bypassing the initially planned Rebel ‘Single’ product to focus on the mass production of the Rebel Quad AI …
[News] SK Hynix President to Join Semicon Taiwan, Bolstering HBM Partnership with TSMC and NVIDIA
According to a report from the Commercial Times, SK hynix is expected to announce a plan of closer collaboration with TSMC and NVIDIA during the Semicon Taiwan exhibition in September, which is likely to focusing on the development of next-generation HBM. This …
[News] Samsung’s Backside Power Delivery Network Reportedly to Reduce 2nm Chip Size by 17%
Earlier in June, Samsung updated its roadmap in the Angstrom era, stating that its 2nm node optimized with backside power delivery network (BSPDN), referred to as SF2Z, will enter mass production in 2027. Now, according to the latest report by …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged BSPDN, Intel, Samsung, TSMC
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[News] GUC’s HBM4 IP Ready, But CSP Adoption Timing Unclear
HBM4, the sixth generation of HBM, is poised to become the key to breakthroughs in computing power for next-generation CSPs (Cloud Service Providers). According to a report from Commercial Times citing Global Unichip Corp. (GUC), to support the development of …