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Recent Posts
- [News] Samsung Considers Shifting Smartphone Production Away from China Amid U.S. Tariff Pressure
- [News] TSMC Reportedly Powers Apple’s iPhone 16e with A18 Chip Built on N3E and C1 Modem on 4nm
- [New] AI Talent Race Heats Up in China as Xiaomi, ByteDance, and Alibaba Compete for Experts
- [News] Trump’s Moves Could Delay CHIPS Act Funding Distribution as NIST Plans Major Staff Cuts
- [News] Singapore Unveils Budget, Boosts Semiconductor Investment
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Author Archives: TrendForce
[News] Micron Reportedly Set to Mass Produce 12-Stack HBM3E, Securing NVIDIA Supply Deal
According to a report from ijiwei, citing Business Korea, Micron Technology is set to begin mass production of its 12-stack HBM and will supply it to AI semiconductor giant NVIDIA. As highlighted by the report, Micron completed the development of …
[News] Next-Gen HBM? NVIDIA Reportedly Teams up with Samsung/ SK hynix to Push SOCAMM for 2025 Production
As NVIDIA collaborates closely with memory heavyweights on their latest HBM products for AI accelerators, the U.S. chip giant is said to be in talks with Samsung and SK hynix to push the commercialization of a next-gen memory technology called SOCAMM …
[News] SK hynix Reportedly Weighs Suspension of Chinese EDA Software Amid Expected U.S. Restrictions
According to a report from Korean Economic Daily, citing industry sources, SK hynix has initiated an urgent review of Chinese semiconductor Electronic Design Automation (EDA) software anticipating that the U.S. may impose restrictions on South Korean semiconductor firms using Chinese …
Posted in Semiconductors
Tagged China and US trade war, EDA, Empyrean Technology, Samsung, SK Hynix
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[News] TSMC, Broadcom Reportedly Explore Breaking Up Intel: Key Scenarios and Impacts in a Nutshell
With Trump pushing tariffs to boost U.S. chipmaking, rumors swirl about a TSMC-Intel deal. Now, Wall Street Journal and Reuters report that while TSMC eyes Intel’s foundry unit, Broadcom may join in, targeting Intel’s chip design and marketing business. Broadcom …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Broadcom, Intel, TSMC
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[News] Global Semiconductor Equipment Market Continues to Expand
Recently, Tokyo Electron (hereinafter referred to as “TEL”) announced plans to build a new production facility in Miyagi Prefecture, Japan. The facility will be managed by TEL’s manufacturing subsidiary, TEL Miyagi, and will primarily produce semiconductor manufacturing equipment such as …